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 NSB4904DW1T1G, NSB4904DW1T2G Dual Bias Resistor Transistors
NPN and PNP Silicon Surface Mount Transistors with Monolithic Bias Resistor Network
The Bias Resistor Transistor (BRT) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base-emitter resistor. These digital transistors are designed to replace a single device and its external resistor bias network. The BRT eliminates these individual components by integrating them into a single device. In the NSB4904DW1T1G and NSB4904DW1T2G, two complementary BRT devices are housed in the SC-88/SOT-363 package which is ideal for low power surface mount applications where board space is at a premium.
Features http://onsemi.com
6 R1 Q1 Q2 R2 1 2 R1 3 5 R2 4
1 SC-88/SOT-363 CASE 419B STYLE 1
* * * *
Simplifies Circuit Design Reduces Board Space Reduces Component Count These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant
MARKING DIAGRAM
6 RC MG G 1 RC = Device Marking M = Date Code G = Pb-Free Package (Note: Microdot may be in either location)
MAXIMUM RATINGS (TA = 25C unless otherwise noted, common for
Q1 and Q2, - minus sign for Q1 (PNP) omitted) Rating Collector-Base Voltage Collector-Emitter Voltage Collector Current Symbol VCBO VCEO IC Value 50 50 100 Unit Vdc Vdc mAdc
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
See specific ordering information in the ordering information table on page 3 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2009
October, 2009 - Rev. 2
1
Publication Order Number: NSB4904DW1T1G/D
NSB4904DW1T1G, NSB4904DW1T2G
THERMAL CHARACTERISTICS
Characteristic (One Junction Heated) Total Device Dissipation TA = 25C Derate above 25C Thermal Resistance - Junction-to-Ambient Characteristic (Both Junctions Heated) Total Device Dissipation TA = 25C Derate above 25C Thermal Resistance - Junction-to-Ambient Thermal Resistance - Junction-to-Lead Junction and Storage Temperature 1. FR-4 @ Minimum Pad. 2. FR-4 @ 1.0 x 1.0 inch Pad. Symbol PD Max 187 (Note 1) 256 (Note 2) 1.5 (Note 1) 2.0 (Note 2) 670 (Note 1) 490 (Note 2) Max 250 (Note 1) 385 (Note 2) 2.0 (Note 1) 3.0 (Note 2) 493 (Note 1) 325 (Note 2) 188 (Note 1) 208 (Note 2) -55 to +150 Unit mW mW/C C/W
RqJA
Symbol PD
Unit mW mW/C C/W C/W C
RqJA RqJL TJ, Tstg
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2
NSB4904DW1T1G, NSB4904DW1T2G
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted, common for Q1 and Q2, - minus sign for Q1 (PNP) omitted) Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector-Base Cutoff Current (VCB = 50 V, IE = 0) Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0) Emitter-Base Cutoff Current (VEB = 6.0 V, IC = 0) Collector-Base Breakdown Voltage (IC = 10 mA, IE = 0) Collector-Emitter Breakdown Voltage (Note 4) (IC = 2.0 mA, IB = 0) ICBO ICEO IEBO V(BR)CBO V(BR)CEO - - - 50 50 - - - - - 100 500 0.1 - - nA nA mA V V
ON CHARACTERISTICS (Note 4)
DC Current Gain (VCE = 10 V, IC = 5.0 mA) Collector-Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA) Output Voltage (on) (VCC = 5.0 V, VB = 3.5 V, RL = 1.0 kW) Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 kW) Input Resistor Resistor Ratio hFE VCE(sat) VOL VOH R1 R1/R2 80 - - 4.9 32.9 0.8 140 - - - 47 1.0 - 0.25 0.2 - 61.1 1.2 V V V kW
3. New resistor combinations. Updated curves to follow in subsequent data sheets. 4. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%.
300 PD, POWER DISSIPATION (mW) 250 200 150 100 50 0 -50 RqJA = 490C/W 0 50 100 TA, AMBIENT TEMPERATURE (C) 150
Figure 1. Derating Curve
ORDERING INFORMATION AND RESISTOR VALUES
Device NSB4904DW1T1G NSB4904DW1T2G R1 (K) 47 47 R2 (K) 47 47 Package SOT-363 (Pb-Free) SOT-363 (Pb-Free) Shipping 3000/Tape & Reel 3000/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
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3
NSB4904DW1T1G, NSB4904DW1T2G
TYPICAL ELECTRICAL CHARACTERISTICS - NSB4904DW1T1G, NSB4904DW1T2G NPN TRANSISTOR
VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS) 10 IC/IB = 10 1000 hFE , DC CURRENT GAIN (NORMALIZED) VCE = 10 V TA = 75C 25C -25C 100
1 25C 75C
TA = -25C 0.1
0.01 0 20 40 IC, COLLECTOR CURRENT (mA) 50
10
1
10 IC, COLLECTOR CURRENT (mA)
100
Figure 2. VCE(sat) versus IC
Figure 3. DC Current Gain
1 f = 1 MHz IE = 0 V TA = 25C
100 75C IC, COLLECTOR CURRENT (mA) 10
25C TA = -25C
0.8 C ob , CAPACITANCE (pF)
0.6
1
0.4
0.1
0.2
0.01 VO = 5 V 0.001 0 2 4 6 Vin, INPUT VOLTAGE (VOLTS) 8 10
0
0
10 20 30 40 VR, REVERSE BIAS VOLTAGE (VOLTS)
50
Figure 4. Output Capacitance
Figure 5. Output Current versus Input Voltage
100 VO = 0.2 V V in , INPUT VOLTAGE (VOLTS) TA = -25C 10 25C 75C
1
0.1 0 10 20 30 40 50 IC, COLLECTOR CURRENT (mA)
Figure 6. Input Voltage versus Output Current
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4
NSB4904DW1T1G, NSB4904DW1T2G
TYPICAL ELECTRICAL CHARACTERISTICS - NSB4904DW1T1G, NSB4904DW1T2G PNP TRANSISTOR
VCE(sat) , MAXIMUM COLLECTOR VOLTAGE (VOLTS) 1 IC/IB = 10 1000 h FE , DC CURRENT GAIN (NORMALIZED)
TA = 75C 25C 100 -25C
TA = -25C 75C 0.1
25C
0.01
0
10 20 30 IC, COLLECTOR CURRENT (mA)
40
10
1
10 IC, COLLECTOR CURRENT (mA)
100
Figure 7. VCE(sat) versus IC
Figure 8. DC Current Gain
1 f = 1 MHz lE = 0 V TA = 25C
100
TA = 75C
25C -25C
IC, COLLECTOR CURRENT (mA)
0.8 C ob , CAPACITANCE (pF)
10 1
0.6
0.4
0.1
0.2
0.01 VO = 5 V 0 1 2 3 4 5 6 7 Vin, INPUT VOLTAGE (VOLTS) 8 9 10
0
0
10 20 30 40 VR, REVERSE BIAS VOLTAGE (VOLTS)
50
0.001
Figure 9. Output Capacitance
Figure 10. Output Current versus Input Voltage
100 VO = 0.2 V V in , INPUT VOLTAGE (VOLTS) TA = -25C 10 25C 75C
1
0.1
0
10
20 30 IC, COLLECTOR CURRENT (mA)
40
50
Figure 11. Input Voltage versus Output Current http://onsemi.com
5
NSB4904DW1T1G, NSB4904DW1T2G
PACKAGE DIMENSIONS
SC-88/SOT-363/SC70-6 CASE 419B-02 ISSUE W
D e
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B-01 OBSOLETE, NEW STANDARD 419B-02. 4 DIM A A1 A3 b C D E e L HE MILLIMETERS MIN NOM MAX 0.80 0.95 1.10 0.00 0.05 0.10 0.20 REF 0.10 0.21 0.30 0.10 0.14 0.25 1.80 2.00 2.20 1.15 1.25 1.35 0.65 BSC 0.10 0.20 0.30 2.00 2.10 2.20 EMITTER 2 BASE 2 COLLECTOR 1 EMITTER 1 BASE 1 COLLECTOR 2 INCHES NOM MAX 0.037 0.043 0.002 0.004 0.008 REF 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 0.045 0.049 0.053 0.026 BSC 0.004 0.008 0.012 0.078 0.082 0.086 MIN 0.031 0.000
6
5
HE
1 2 3
-E-
b 6 PL 0.2 (0.008)
M
E
M
A3 C A
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
A1
L
SOLDERING FOOTPRINT*
0.50 0.0197
0.65 0.025 0.65 0.025
0.40 0.0157 1.9 0.0748
SCALE 20:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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6
NSB4904DW1T1G/D


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